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APAC Innovation Summit 2017 Series – Robotics

2017年06月05日至2017年06月06日

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APAC Innovation Summit 2017 Series – Robotics


Date : 5-6 June 2017
Time : 09:30 - 17:30
Venue :    Grand Hall (Convention Centre 3) and Charles K. Kao Auditorium, Science Park
Organiser : Hong Kong Science and Technology Parks Corporation (HKSTP) 

Brief Description :
Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of robotics. Conference Highlights: 
-Future A.I.
-A.I. ethics
-Industrial application of A.I.    
-Robots leaving the production halls – opportunities and challenges

Event Website : https://apacinnosummit.hkstp.org/en/
Contact: +852 2629 6840 / ais.info@hkstp.org

Book your tickets at MIT Technology Review’s EmTech Hong Kong 2017!

2017年06月06日至2017年06月07日

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Back to 活动资讯

Dialogue with the Technology Transfer Office @ HKU

2017年04月28日

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