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HKU wins TechConnect Global Innovation Awards at TechConnect World Innovation Conference & Expo 2018

2018年04月29日

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The University of Hong Kong (HKU) has won two TechConnect Global Innovation Awards at the TechConnect World Innovation Conference & Expo (TCWI) 2018 to be held in the United States in May. 

The two award winning innovations are “Omniphobic porous membrane and methods for preparing the same” and “Super Steel - A method for the fabrication of a super-strong and ductile multi-phase steel”, both by the HKU Department of Mechanical Engineering.

HKU Vice President (Research) Professor Andy Hor congratulated the research teams. He said:“These prestigious global awards are testimony of the potential impact of our innovations and technologies in future industries. It gives our professors and researchers the confidence that while we are advancing novel science at the fundamental frontiers, there is also room for incubation of disruptive technologies that will shape the human world.”

The Innovation Awards identify the top 15% of submitted technologies as ranked by the TechConnect Corporate & Investment Partner Committee. Innovation rankings are based on the potential positive impact the submitted technology will have on a specific industry sector. Over 240 submissions from about 95 organisations including global academic technology transfer offices, early-stage companies, small business innovative research (SBIR) awardees, and government and corporate research laboratories were received this year.

The aim of TCWI is to accelerate the commercialisation of innovations out of the lab for applications in the industry. For over 20 years, the event has been held to connect top applied research and early-stage innovations from universities, labs, and startups with industry end-users and prospectors.

For more information, please visit : https://www.hku.hk/press/news_detail_17818.html

Winner of "The 3rd Spirit of Hong Kong Awards 2015"

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